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Optica Publishing Group
  • Conference on Lasers and Electro-Optics
  • (Optica Publishing Group, 1998),
  • paper CThG6

Chip-level three-dimensional stacking for free-space optical interconnects

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Abstract

Although steady advances result in electronic systems with increasing capabilities, electronic-only systems remain inadequate in the manipulation and processing of large data arrays.

© 1998 Optical Society of America

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