Abstract
Passive alignment is a key technology for low-cost packaging of single-mode fiber-coupled devices for telecommunication applications. The method is even more advantageous for packaging arrays, because all of the fiber ports axe coupled in one simple operation. Several examples of coupling a laser to a fiber held in a V-groove on a silicon substrate have been published.1"3 In this paper, we report coupling from a laser array mounted directly on a silica-on-silicon passive waveguide array, as shown in Fig. 1. Using this scheme, an active laser array can be coupled to a passive silica-on-silicon circuit such as a filter or a combiner. This type of functionality is very desirable for devices such as WDM transmitters. We present a technique that can achieve excellent coupling while preserving the thermal performance of p-down mounted laser diodes. To this effect, we use micromachined alignment features on both the diode laser and the silicon carrier, combined with a thin-solder process compatible with conventional p-down laser bonding techniques.
© 1996 Optical Society of America
PDF ArticleMore Like This
J-M Verdiell, M. Ziari, and D.F. Welch
IThB5 Integrated Photonics Research (IPR) 1996
W. Hunziker, W. Vogt, and H. Melchior
SaC3 Integrated Photonics Research (IPR) 1994
A. J. Negri, J. F. Mehr, G. A. Duchene, M. J. Tabasky, CA. Armiento, P. O. Haugsjaa, D. Yap, H. P. Hsu, W. W. Ng, D. M. Bohmeyer, and H. W. Yen
IWH4 Integrated Photonics Research (IPR) 1996