Optical backplane demonstrators using micro-optics and smart-pixel transceiver arrays

D. V. Plant; B. Robertson; H. S. Hinton; W. M. Robertson; G. C. Boisset; N. H. Kim; Y. S. Liu; M. R. Otazo; D. R. Rolston; A. Z. Shang

Conference on Lasers and Electro-Optics
OSA Technical Digest (Optica Publishing Group, 1995),
paper CFF2

Optical backplane demonstrators using micro-optics and smart-pixel transceiver arrays

D. V. Plant, B. Robertson, H. S. Hinton, W. M. Robertson, G. C. Boisset, N. H. Kim, Y. S. Liu, M. R. Otazo, D. R. Rolston, and A. Z. Shang

Conference on Lasers and Electro-Optics 1995

Baltimore, Maryland United States
21–26 May 1995
ISBN: 1-55752-400-9

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Optical Interconnects (CFF)

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D. V. Plant, B. Robertson, H. S. Hinton, W. M. Robertson, G. C. Boisset, N. H. Kim, Y. S. Liu, M. R. Otazo, D. R. Rolston, and A. Z. Shang, "Optical backplane demonstrators using micro-optics and smart-pixel transceiver arrays," in Conference on Lasers and Electro-Optics, T. Deutsch, J. Goldsmith, D. Killinger, and G. Valley, eds., Vol. 15 of OSA Technical Digest (Optica Publishing Group, 1995), paper CFF2.

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Abstract

Free-space optical interconnects represent a solution to the problems of future connection-intensive digital systems, such as ATM switching systems and massively-parallel-processing computer systems. These systems will require the large board-to-board connectivity provided by an optical backplane created with two-dimensional arrays of passive, free-space parallel optical channels (POCs) to optically interconnect electronic printed circuit boards (PCBs) and/or multichip modules (MCMs). Such a backplane could be capable of supporting terabit-per-second aggregate capacities with connectivity levels of the order of 10⁴ input/output channels per PCB.

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