Abstract
Removal of particulate contamination from solid surfaces is a major concern in the fabrication of integrated circuits (ICs), packaging, high density storage, and other electronic devices. These particulate contaminants cause defects on products and can greatly reduce yield. Removal of small particles from solid surfaces is, however, very difficult when the particle size is in the micron or submicron range. For such small particles the weight of the particle becomes insignificant compared to other adhesive forces.1 Particulate contaminants also affect other systems, such as high-power laser optics, where particles on surfaces and interfaces can increase optical absorption and decrease the laser damage threshold.
© 1992 Optical Society of America
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