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Ultraviolet etching of polyimide with picosecond laser pulses

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Abstract

Photoetching with excimer laser radiation has been an active area of research since its discovery by Srinivasan in 1982.1,2 The apparently low thermal damage associated with these lasers has been attributed to the fact that ablation is caused by direct bond-breaking of the long chain polymer links, in which excess energy is carried away by smaller volatile fragments. There is, however, still a controversial discussion about the mechanism, and a thermal model has been suggested3 which may contribute to the degradation of the polymer. But so far the dynamics of ablative photodecomposition has not yet been studied experimentally on a picosecond time scale. In the present work results of a picosecond ablation study on polyimide will be reported and discussed in terms of a time-dependent absorption model.

© 1986 Optical Society of America

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