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Laser-jet plating of gold and copper: mechanisms and recent results

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Abstract

We have analyzed data for laser-jet gold and copper electroplating obtained with a two-electrode galvanostatically controlled system. Galvanostatic conditions determine the total amount of current available for reduction processes and maintain that current at a fixed value. In contrast, the carrent can vary when potentiostatic (i.e., fixed voltage or overvoltage) control is used. We have measured experimentally obtained deposition height/area and determined the reduction current/area required for the metallic deposit. The ratio of this current density to the total current density flowing in the system defines the plating efficiency.

© 1985 Optical Society of America

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