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Heatspreader-based thermal management in VECSELs: thermal lensing in microchip devices

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Abstract

Finite-element analysis is used to explore the practicalities and scaling potential of heatspreaders in vertical-external-cavity surface-emitting lasers. Thermal lensing and its implications for quasi-monolithic microchip geometries are emphasised.

© 2005 Optical Society of America

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