Abstract

Glass and other brittle, transparent materials offer unique properties, that will fuel a continuously growing use in consumer electronics, medical devices, integrated circuits, architectural, automotive, aerospace and a variety of other interesting market segments. Due to low absorption and a typically low thermal-shock resistance, laser processes on glass have always been challenging. Driven by the constant need to reduce the number of processing steps, the amount of waste material, and the use of water in production, the market is strongly pushing laser manufacturers and system integrators to offer alternatives to conventional mechanical technologies. In micro-processing tasks such as cutting and drilling, there is especially a need for more precise and less water-consuming technologies. Various approaches have been taken in the past, with more or less success, to qualify lasers for cutting of glass or other transparent and brittle materials

© 2015 Optical Society of America

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