Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > ASSL > 2014 > AM5A > AM5A.59

Soldering process induced residual stress of disk laser module

Mu wang, Guangzhi Zhu, Shijie Wu, Na Shao, and Xiao Zhu

Not Accessible

Your library or personal account may give you access

Abstract

By numerical analysis, when packing laser disk crystal, using the Copper tungsten CuW75 which contain 25% mass fraction copper as the heatsink and gold-tin eutectic solder layer of greater than 50um thickness, the residual stress of solder layer after soldering process will be below tensile strength. In such a configuration, packing disk active laser gain mirror can increase the yield ratio.

© 2014 Optical Society of America

PDF Article
More Like This
Laser Induced Shock Waves: Pressure Waves and Residual Stress in Thin Films

R. Ostrowski, J. Radziejewska, A. Sarzyński, A. Rycyk, K. Czyż, M. Strzelec, and R. Diduszko
CM_P_28 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2017

Research of measuring residual stress in laser cladding with anisotropic material based on reverse deduce

Zhang Zhi and HU Mu-lin
TUP13_5 Conference on Lasers and Electro-Optics/Pacific Rim (CLEO/PR) 2009

Analytical model of Optical path difference in Yb:YAG thin disk laser

Guangzhi Zhu, Yufan Feng, Xiao Zhu, and Changhong Zhu
ATu2A.25 Advanced Solid State Lasers (ASSL) 2014

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use