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Improving Yield in Wafer Level Cameras through Specialized Design and Process Monitoring

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Abstract

The production of compact camera modules using a wafer level manufacturing approach continues to gain traction. The wafer level manufacturing process is highly parallel and relies on tighter integration with the sensor to reduce cost. One key challenge associated with wafer level optics manufacturing is that it is much more difficult to evaluate the camera module manufacturing precision in order to accurately monitor the manufacturing process in-line. This paper describes the wafer level manufacturing process and an in-line process monitoring algorithm that leverages common image test data to estimate the manufacturing errors in the camera module. The real-time estimation of camera module errors can be used to improve yield, reduce cost, and minimize product development times of miniature camera modules.

© 2011 Optical Society of America

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