Dual-mode FMF to SOI chip edge coupler

Weilun Zhang; Weilun Zhang; Mengyuan Ye; Mengyuan Ye; Yunlong Li; Yunlong Li

doi:10.1364/ACPC.2021.T4A.242

Asia Communications and Photonics Conference 2021
Technical Digest Series (Optica Publishing Group, 2021),
paper T4A.242
•https://doi.org/10.1364/ACPC.2021.T4A.242

Dual-mode FMF to SOI chip edge coupler

Weilun Zhang, Mengyuan Ye, and Yunlong Li

Asia Communications and Photonics Conference 2021

Shanghai China
24–27 October 2021
ISBN: 978-1-957171-00-5

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W. Zhang, M. Ye, and Y. Li, "Dual-mode FMF to SOI chip edge coupler," in Asia Communications and Photonics Conference 2021, C. Chang-Hasnain, A. Willner, W. Shieh, P. Shum, Y. Su, G. Li, B. Eggleton, R. Essiambre, D. Dai, and D. Ma, eds., Technical Digest Series (Optica Publishing Group, 2021), paper T4A.242.

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Abstract

Dual-mode edge coupler for few mode fiber (FMF) to silicon chip is proposed. LP01 and LP11 modes could be efficiently coupled into TE0 and TE1 modes in waveguides via the proposed coupler in simulation.

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