Micro-Transfer-Printing for III-V/Si PICs

Jing Zhang; Jing Zhang; Camiel Op de Beeck; Bahawal Haq; Jeroen Goyvaerts; Stijn Cuyvers; Sulakshna Kumari; Grigorij Muliuk; Artur Hermans; Agnieszka Gocalinska; Emanuele Pelucchi; Brian Corbett; Antonio Jose Trindade; Chris Bower; Joris Van Campenhout; Guy Lepage; Peter Verheyen; Bart Kuyken; Bart Kuyken; Dries Van Thourhout; Dries Van Thourhout; Geert Morthier; Geert Morthier; Roel Baets; Roel Baets; Gunther Roelkens; Gunther Roelkens

doi:10.1364/ACPC.2020.T4G.3

Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
OSA Technical Digest (Optica Publishing Group, 2020),
paper T4G.3
•https://doi.org/10.1364/ACPC.2020.T4G.3

Micro-Transfer-Printing for III-V/Si PICs

Jing Zhang, Camiel Op de Beeck, Bahawal Haq, Jeroen Goyvaerts, Stijn Cuyvers, Sulakshna Kumari, Grigorij Muliuk, Artur Hermans, Agnieszka Gocalinska, Emanuele Pelucchi, Brian Corbett, Antonio Jose Trindade, Chris Bower, Joris Van Campenhout, Guy Lepage, Peter Verheyen, Bart Kuyken, Dries Van Thourhout, Geert Morthier, Roel Baets, and Gunther Roelkens

Asia Communications and Photonics Conference 2020

Beijing China
24–27 October 2020
ISBN: 978-1-943580-82-8

From the session
Heterogeneous Integration II (T4G)

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J. Zhang, C. Op de Beeck, B. Haq, J. Goyvaerts, S. Cuyvers, S. Kumari, G. Muliuk, A. Hermans, A. Gocalinska, E. Pelucchi, B. Corbett, A. J. Trindade, C. Bower, J. Van Campenhout, G. Lepage, P. Verheyen, B. Kuyken, D. Van Thourhout, G. Morthier, R. Baets, and G. Roelkens, "Micro-Transfer-Printing for III-V/Si PICs," in Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC), K. Xu, D. Simeonidou, C. Chang-Hasnain, N. Wada, X. Ren, Z. Zhukov, P. Perry Shum, Y. Ji, J. Zhang, X. Zhou, C. Lu, and L. Wosinska, eds., OSA Technical Digest (Optica Publishing Group, 2020), paper T4G.3.

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Abstract

Micro-transfer-printing (µTP) enables the intimate integration of a variety of III-V opto-electronic components on silicon photonic integrated circuits (Si PICs). It allows for the scalable manufacturing of complex III-V/Si PICs at low cost.

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