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  • Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
  • OSA Technical Digest (Optica Publishing Group, 2020),
  • paper T3G.1
  • https://doi.org/10.1364/ACPC.2020.T3G.1

Silicon Optical Interposer for EPIC 2.5D Integration

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Abstract

A Silicon Optical Interposer for 2.5D integration of high speed electrical and optical circuit is proposed here. The Si Interposer functions as a Base Substrate for optical alignment of the Photonic IC and the fibers which are held in a Si Fiber Block or integrate directly. The alignment is semi passive, it utilizes a set of U-grooves with submicron accuracy and Dummy Fiber’s cylindrical face for self-alignment. The Photonic IC and the Fiber Block are faced down assembled on the Si Interposer. Electrical connections are made using flip chip micro bumps between the Photonic IC and the Si Interposer.

© 2020 The Author(s)

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