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Conferences > ACPC > 2020 > S3I > S3I.4
  • Asia Communications and Photonics Conference/International Conference on Information Photonics and Optical Communications 2020 (ACP/IPOC)
  • OSA Technical Digest (Optica Publishing Group, 2020),
  • paper S3I.4
  • •https://doi.org/10.1364/ACPC.2020.S3I.4

Ultra-Compact Silicon Multimode Waveguide Bends with Shallow-Etched Grooves

Sai Gao, Hongwei Wang, Xiaogen Yi, and Ciyuan Qiu

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Abstract

A novel design for ultra-compact multi-mode waveguide bend is proposed, which enables the first four TE mode-channels with an ultra-small bending radius of 5.6 μm. And a specific design example is given and fabricated.

© 2020 The Author(s)

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