Modeling and Analysis of Thermal Effect of Optical Networks-on-Chip

Lixia Fu; Yiyuan Xie; Ye Su; Tingting Song

Asia Communications and Photonics Conference (ACPC) 2019
OSA Technical Digest (Optica Publishing Group, 2019),
paper M4A.94

Modeling and Analysis of Thermal Effect of Optical Networks-on-Chip

Lixia Fu, Yiyuan Xie, Ye Su, and Tingting Song

Asia Communications and Photonics Conference 2019

Chengdu China
2–5 November 2019
ISBN: 978-1-943580-70-5

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Joint Poster Session (M4A)

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L. Fu, Y. Xie, Y. Su, and T. Song, "Modeling and Analysis of Thermal Effect of Optical Networks-on-Chip," in Asia Communications and Photonics Conference (ACPC) 2019, OSA Technical Digest (Optica Publishing Group, 2019), paper M4A.94.

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Abstract

In this paper, the influence of thermal effect on network performance from device level to network level is modeled and analyzed. The models established has high portability, which provides technical foundation for future research work.

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