Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Hybrid integration of III–V on Silicon devices for future optical networks

Not Accessible

Your library or personal account may give you access

Abstract

Recent progresses on hybrid integration of III-V on Silicon devices using a wafer bonding technique are presented as well as their applications for next generation of access, metropolitan and long haul networks.

© 2013 Optical Society of America

PDF Article
More Like This
Hybrid III-V Silicon Photonic Integrated Circuits

G.-H. Duan, G. Levaufre, A. Shen, N. Girard, S. Olivier, S. Malhouitre, A. Accard, C. Jany, A. Le Liepvre, D. Make, F. Lelarge, J. Decobert, G. de Valicourt, K. Ribaud, and C. Kopp
IT1A.1 Integrated Photonics Research, Silicon and Nanophotonics (IPR) 2015

III–V on Silicon Transmitters

G.-H. Duan, C. Jany, A. Le Liepvre, M. Lamponi, A. Accard, D. Make, F. Lelarge, S. Messaoudene, D. Bordel, J.-M. Fedeli, S. Keyvaninia, G. Roelkens, D. Van Thourhout, D. J. Thomson, F. Y. Gardes, and G. T. Reed
OM3K.4 Optical Fiber Communication Conference (OFC) 2013

III-V/Silicon Photonics for Optical Interconnects: Bonding Technology and Integrated Devices

G. Roelkens, J. Brouckaert, J. Van Campenhout, D. Van Thourhout, and R. Baets
FThH3 Frontiers in Optics (FiO) 2007

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved