Using wafer scale optics, wafer scale integration, and wafer level packaging of image sensor, we developed small form factor (3.3mmx3.3mmx2.4mm), low manufacturing cost, Pb-free solder reflow compatible digital camera modules which are suitable for many applications including mobile electronic devices, automotives, security, and medical applications.

© OSA, IEEE Photonics Society, SPIE, COS, CIC

PDF Article