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Optical Interconnect with Densely Integrated Plasmonic Modulator and Germanium Photodetector Arrays

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Abstract

We demonstrate the first chip-to-chip interconnect utilizing a densely integrated plasmonic Mach-Zehnder modulator array operating at 3 × 10 Gbit/s. A multicore fiber provides a compact optical interface, while the receiver consists of germanium photodetectors.

© 2016 Optical Society of America

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