Femtosecond laser processing of silicon showed effective material removal, but with detrimental artifacts resulting from heating and oxidation. A thermal model was constructed to predict optimized processing parameters to mitigate heat accumulation.

© 2016 Optical Society of America

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription