We report an ultrafast surface inspection method using a hybrid dispersion laser scanner. Using the technique, we demonstrate real-time detection of microparticles on silicon wafer surfaces at 1,000 times higher scan rates than conventional methods.

© 2013 OSA

PDF Article | Presentation Video

Supplementary Material (1)

Presentation video access is available to:

  1. OSA Publishing subscribers
  2. Technical meeting attendees
  3. OSA members who wish to use one of their free downloads. Please download the article first. After downloading, please refresh this page.

Contact your librarian or system administrator
Log in to access OSA Member Subscription or free downloads