Abstract

Hybrid photonic integration allows to combine the complementary advantages of different material platforms while maintaining the processing and scalability advantages of monolithically integrated systems. Here we give an overview on our research in the field of hybrid integration, combining multi-chip approaches on a package level with hybrid on-chip integration using both back-end-of-line (BEOL) and front-end-of-line (FEOL) processes.

© 2018 The Author(s)

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