We propose a high-density, low-power optical chip scale package transceiver scheme facing future high capacity network. With novel ultra-dense SiPh coupling solution, OCSP with 336 channels is achievable in scenarios of edge and surface coupling.

© 2016 Optical Society of America

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription