Abstract
We report here on the design, fabrication, and high-speed performance of a
compact 48-channel optical transceiver module enabled by a key novel
component: a “holey” Optochip. A single CMOS transceiver
chip with 24 receiver (RX) and 24 laser diode driver circuits, measuring 5.2 mm$\,\times\,$5.8 mm, becomes a holey Optochip with the fabrication of
forty-eight through-substrate optical vias (holes): one for each transmitter
(TX) and RX channel. Twenty-four channel, 850-nm VCSEL and photodiode arrays
are directly flip-chip soldered to the Optochip with their active devices
centered on the optical vias such that optical I/O is accessed through the
substrate of the CMOS IC. The holey Optochip approach offers numerous
advantages: 1) full compatibility with top emitting/detecting 850-nm
VCSELs/PDs that are currently produced in high volumes; 2) close integration
of the VCSEL/PD devices with their drive electronics for optimized
high-speed performance; 3) a small-footprint, chip-scale package that
minimizes CMOS die cost while maximizing transceiver packing density; 4)
direct coupling to standard 4$\,\times\,$12 multimode fiber arrays through a 2-lens optical system; and 5)
straightforward scaling to larger 2-D arrays of TX and RX channels.Complete transceiver modules, or holey Optomodules, have been produced by
flip-chip soldering assembled Optochips to high-density, high-speed organic
carriers. A pluggable connector soldered to the bottom of the Optomodule
provides all module electrical I/O. The Optomodule footprint, dictated by
the 1-mm connector pitch, is 21 mm$\,\times\,$21 mm. Fully functional holey Optomodules with 24 TX and 24 RX
channels operate up to 12.5 Gb/s/ch achieving efficiencies (including both
TX and RX) of 8.2 pJ/bit. The aggregate 300-Gb/s bi-directional data rate is
the highest ever reported for single-chip transceiver modules.
© 2010 IEEE
PDF Article
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