Abstract
Low $V_{\pi}$ electro–optic (EO) polymer modulators were environmental
stress tested at both the chip and packaged device level. Different top clad
materials showed different results for high-temperature and temperature cycle
testing, which is related mostly to coefficient of thermal expansion (CTE)
mismatches and/or adhesion properties of the clads related to other materials
in the devices stack and to the substrate and electrode materials. With thoroughly
compatible cladding, devices that are thermally stable for over 5000 h at
85 $^{\circ}$C
have been achieved. High optical power (500 mW
@ 1550 nm) tests showed the photochemical stability of the EO polymer material
in hermetically sealed packages. The results demonstrate that clad polymers
and interactions between devices layers are of concern for achieving environmentally
stable EO polymers modulators.
© 2009 IEEE
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