Abstract
We describe an improved scheme of spectrally resolved white-light interferometry,
which provides 3D visual inspection of a thin-film layer structure with nanometer
level resolutions. Compared to the authors’ previous method [Appl. Phys. Lett. 91, 091903
(2007)], 3D tomographic
information of thin films can be obtained by decoupling the film thickness and top
surface profile, which is embodied by inducing spectral carrier frequency to the
reference arm and applying a low-pass filter to the interfero gram instead of two
troublesome measurement steps of activating and deactivating a mechanical shutter. We
test and verify our proposed method by measuring a patterned thin-film layer
structure as well as standard specimens of thin films with various thicknesses.
© 2009 Optical Society of America
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