Recent Progress in Silicon Photonics R&amp;D and Manufacturing on 300mm Wafer Platform

F. Boeuf; S. Cremer; E. Temporiti; M. Fere’; M. Shaw; N. Vulliet; B. Orlando; D. Ristoiu; A. Farcy; T. Pinguet; A. Mekis; G. Masini; P. Sun; Y. Chi; H. Petiton; S. Jan; J. R. Manouvrier; C. Baudot; P. Le Maitre; J-F. Carpentier; L. Salager; M. Traldi; L. Maggi; D. Rigamonti; C. Zaccherini; C. Elemi; B. Sautreuil; L. Verga

doi:10.1364/OFC.2015.W3A.1

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper W3A.1
•https://doi.org/10.1364/OFC.2015.W3A.1

Recent Progress in Silicon Photonics R&D and Manufacturing on 300mm Wafer Platform

F. Boeuf, S. Cremer, E. Temporiti, M. Fere’, M. Shaw, N. Vulliet, B. Orlando, D. Ristoiu, A. Farcy, T. Pinguet, A. Mekis, G. Masini, P. Sun, Y. Chi, H. Petiton, S. Jan, J. R. Manouvrier, C. Baudot, P. Le Maitre, J-F. Carpentier, L. Salager, M. Traldi, L. Maggi, D. Rigamonti, C. Zaccherini, C. Elemi, B. Sautreuil, and L. Verga

Optical Fiber Communication Conference 2015

Los Angeles, California United States
22–26 March 2015
ISBN: 978-1-55752-937-4

From the session
Silicon Photonics II (W3A)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
F. Boeuf, S. Cremer, E. Temporiti, M. Fere’, M. Shaw, N. Vulliet, B. Orlando, D. Ristoiu, A. Farcy, T. Pinguet, A. Mekis, G. Masini, P. Sun, Y. Chi, H. Petiton, S. Jan, J. R. Manouvrier, C. Baudot, P. Le Maitre, J. Carpentier, L. Salager, M. Traldi, L. Maggi, D. Rigamonti, C. Zaccherini, C. Elemi, B. Sautreuil, and L. Verga, "Recent Progress in Silicon Photonics R&D and Manufacturing on 300mm Wafer Platform," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper W3A.1.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Citation alert
Save article

Abstract

A low cost 28Gbits/s Silicon Photonics platform using 300mm SOI wafers is demonstrated. Process, 3D integration of Electronic and Photonic ICs, device performance, circuit results and low cost packaging are discussed.

PDF Article

More Like This

Latest Progress and Challenges in 300 mm Monolithic Silicon Photonics Manufacturing

Takako Hirokawa, Yusheng Bian, Ken Giewont, Abdelsalam Aboketaf, Sujith Chandran, Jae-Kyu Cho, Zahidur Chowdhury, Won Suk Lee, Qidi Liu, Prateek Sharma, Massimo Sorbara, Frederick G. Anderson, Farid Barakat, Arpan Dasgupta, Kevin Dezfulian, Thomas Houghton, Jason Kim, Yarong Lin, Norman Robson, Vaibhav Ruparelia, Shenghua Song, Ryan Sporer, Teck-Jung Tang, Janet Tinkler, Helen Wong, and Michelle Zhang
Th3H.2 Optical Fiber Communication Conference (OFC) 2024

Metasurface Manufacturing on 300-mm Wafer Platforms

Nanxi Li, Zhengji Xu, Yuan Dong, Ting Hu, Qize Zhong, Yuan Hsing Fu, Shiyang Zhu, and Navab Singh
SF1J.6 CLEO: Science and Innovations (CLEO:S&I) 2020

Ultra-Low Loss Silicon Nitride Waveguides on Monolithic Integrated Photonics Circuits for a Mature 300 mm Wafer Scale Silicon Photonics Platform

Yukta P. Timalsina, Gerald Leake, Tat Ngai, Alin Antohe, Siti K. Binti, Christopher Baiocco, Nicholas M. Fahrenkopf, and David Harame
AM4M.7 CLEO: Applications and Technology (CLEO:A&T) 2023

Previous Article Next Article