Abstract
High-speed communications require photonic devices handling data rates greater than 200 Gbps. We present GaAsSb/Si heterojunction devices via direct bonding of GaAsSb to Si as a method to develop avalanche photodiodes for enhanced chip-to-chip connectivity.
© 2023 The Author(s)
PDF ArticleMore Like This
Tobias Beckerwerth, Christoph Kottke, Volker Jungnickel, Ute Tropenz, Martin Möhrle, Patrick Runge, and Martin Schell
Tu3I.2 Optical Fiber Communication Conference (OFC) 2023
Naseem, Nan-Wei Chen, Syed Hasan Parvez, Zohauddin Ahmad, Sean Yang, H.-S. Chen, Hsiang-Szu Chang, Jack Jia-Sheng Huang, and Jin-Wei Shi
W2A.8 Optical Fiber Communication Conference (OFC) 2023
X. Sun, S. Wang, X. G. Zheng, X. Li, J. C. Campbell, and A. L. Holmes
IThE4 Integrated Photonics Research (IPR) 2002