Abstract
Power scaling of microchip lasers with high-beam quality, robustness, reliability and simplicity is desirable for industrial and medical applications. The main point in designing high-power small-size lasers is related to heat removal management. One solution for improved heat transfer is to decrease the active medium thickness until the heat flows axially [1-4]. Thus, when the medium thickness is reduced to hundreds of microns the thermal induced lens almost disappears and heat transfer is dramatically improved. However, a thin thickness comes with low absorption, which requires multi-pass absorption [2]. Alternatively, efficient composite edge-pumped thin disk needs more optical systems to insert laser diode pump beam through the crystal’s edge [3].
© 2015 IEEE
PDF ArticleMore Like This
I. Johannsen, S. Erhard, D. Müllier, C. Stewen, A. Giesen, and K. Contag
TuB7 Advanced Solid State Lasers (ASSL) 2000
Masaki Tsunekane and Takunori Taira
T4A.3 Laser Ignition Conference (LIC) 2015
Andrew P. Ongstad, Matthew R. Guy, and Joseph Chavez
AF1A.5 Advanced Solid State Lasers (ASSL) 2015