Direct Bonding Nd:YAG to Sapphire Wafers

Henry G. Stenhouse; Stephen J. Beecher; Jacob I. Mackenzie

doi:10.1364/ASSL.2017.JM5A.3

Laser Congress 2017 (ASSL, LAC)
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper JM5A.3
•https://doi.org/10.1364/ASSL.2017.JM5A.3

Direct Bonding Nd:YAG to Sapphire Wafers

Henry G. Stenhouse, Stephen J. Beecher, and Jacob I. Mackenzie

Advanced Solid State Lasers 2017

Nagoya, Aichi Japan
1–5 October 2017
ISBN: 978-0-9600380-7-7

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Poster Session Monday (Student Session) (JM5A)

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H. G. Stenhouse, S. J. Beecher, and J. I. Mackenzie, "Direct Bonding Nd:YAG to Sapphire Wafers," in Laser Congress 2017 (ASSL, LAC), OSA Technical Digest (online) (Optica Publishing Group, 2017), paper JM5A.3.

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Abstract

We demonstrate chemical-assisted direct bonding of 450µm-thick neodymium-doped YAG to 660µm-thick sapphire wafers. Diced, polished and AR-coated the composite was trialed in a pump-guided free-space laser. Preliminary performance and future prospects will be discussed.

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