A pair of integrated optoelectronic chips for optical interconnects

Qi Wei; Kai Liu; Yongqing Huang; Xiaofeng Duan; Qi Wang; Xiaomin Ren; Shiwei Cai

Asia Communications and Photonics Conference (ACP) 2018
OSA Technical Digest (Optica Publishing Group, 2018),
paper Su2A.242

A pair of integrated optoelectronic chips for optical interconnects

Qi Wei, Kai Liu, Yongqing Huang, Xiaofeng Duan, Qi Wang, Xiaomin Ren, and Shiwei Cai

Asia Communications and Photonics Conference 2018

Hangzhou China
26–29 October 2018
ISBN: 978-1-5386-6158-1

From the session
Poster Session (Su2A)

Not Accessible

Your library or personal account may give you access

Get PDF
Email
Share
Get Citation
Copy Citation Text
Q. Wei, K. Liu, Y. Huang, X. Duan, Q. Wang, X. Ren, and S. Cai, "A pair of integrated optoelectronic chips for optical interconnects," in Asia Communications and Photonics Conference (ACP) 2018, OSA Technical Digest (Optica Publishing Group, 2018), paper Su2A.242.

Export Citation
- BibTex
- Endnote (RIS)
- HTML
- Plain Text
Save article

Abstract

A pair of integrated optoelectronic chips based on VCSEL (Vertical-Cavity Surface-Emitting Laser) and PIN-PD is proposed for optical interconnects. The matched chips can realize bidirectional communications on a single fiber.

PDF Article

Previous Article Next Article