Stress control in optical thin films by sputtering and electron beam evaporation

Naoya Tajima; Hiroshi Murotani; Shigeharu Matsumoto; Hiromitsu Honda

doi:10.1364/AO.56.00C131

Applied Optics
Vol. 56,
Issue 4,
pp. C131-C135
(2017)
•https://doi.org/10.1364/AO.56.00C131

Stress control in optical thin films by sputtering and electron beam evaporation

Naoya Tajima, Hiroshi Murotani, Shigeharu Matsumoto, and Hiromitsu Honda

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Naoya Tajima, Hiroshi Murotani, Shigeharu Matsumoto, and Hiromitsu Honda, "Stress control in optical thin films by sputtering and electron beam evaporation," Appl. Opt. 56, C131-C135 (2017)

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Abstract

It is necessary to control the internal stress of optical thin films in order to address problems such as peeling and cracking. Internal stress differs among films prepared by different deposition methods. We investigated the internal stress of films prepared by sputtering, electron beam (EB) evaporation, and a combination deposition method that we developed. The internal stress was successfully controlled, showing a value between that of EB evaporation and sputtering.

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Film Thickness Ratio	First Layer		Second Layer
Film Thickness Ratio	Deposition Method	Thickness (nm)	Deposition Method	Thickness (nm)
$Sp : EB = 1 : 9$	Sputtering	50	EB	450
$Sp : EB = 3 : 7$		150		350
$Sp : EB = 5 : 5$		250		250
$EB : Sp = 9 : 1$	EB	450	Sputtering	50
$EB : Sp = 7 : 3$		350		150
$EB : Sp = 5 : 5$		250		250

Deposition Conditions	Compressive Stress (MPa)
	Time after Deposition (h)					Stress Difference between 12 (h) and 168 (h)
	12	24	48	72	168	Stress Difference between 12 (h) and 168 (h)
EB	169.5	124.9	105.5	101.2	86.9	82.6
$Sp : EB = 1 : 9$	200.0	182.3	189.2	144.7	142.6	57.4
$Sp : EB = 3 : 7$	204.5	162.3	153.4	141.5	135.9	68.6
$Sp : EB = 5 : 5$	217.7	201.4	175.9	198.1	173.3	44.4
$EB : Sp = 9 : 1$	214.0	192.0	188.4	155.4	149.9	64.1
$EB : Sp = 7 : 3$	192.9	199.3	185.3	191.8	183.6	6.0
$EB : Sp = 5 : 5$	194.0	195.9	196.7	201.4	198.9	4.9
Sputtering	292.5	302.5	305.1	279.3	293.0	0.5

Deposition Method	Refractive Index ( $λ = 550 nm$ )	Pencil Hardness Test	Indenter Hardness (GPa)
EB	1.46	5 H	7.44
Sputtering	1.47	9 H or more	19.67
$Sp : EB = 1 : 9$	1.46	6 H	8.37
$Sp : EB = 3 : 7$	1.46	6 H	8.53
$Sp : EB = 5 : 5$	1.47	6 H	7.30
$EB : Sp = 9 : 1$	1.46	6 H
$EB : Sp = 7 : 3$	1.46	8 H	13.67
$EB : Sp = 5 : 5$	1.47	9 H or more	18.33

Film Thickness Ratio	First Layer		Second Layer
Film Thickness Ratio	Deposition Method	Thickness (nm)	Deposition Method	Thickness (nm)
$Sp : EB = 1 : 9$	Sputtering	50	EB	450
$Sp : EB = 3 : 7$		150		350
$Sp : EB = 5 : 5$		250		250
$EB : Sp = 9 : 1$	EB	450	Sputtering	50
$EB : Sp = 7 : 3$		350		150
$EB : Sp = 5 : 5$		250		250

Deposition Conditions	Compressive Stress (MPa)
	Time after Deposition (h)					Stress Difference between 12 (h) and 168 (h)
	12	24	48	72	168	Stress Difference between 12 (h) and 168 (h)
EB	169.5	124.9	105.5	101.2	86.9	82.6
$Sp : EB = 1 : 9$	200.0	182.3	189.2	144.7	142.6	57.4
$Sp : EB = 3 : 7$	204.5	162.3	153.4	141.5	135.9	68.6
$Sp : EB = 5 : 5$	217.7	201.4	175.9	198.1	173.3	44.4
$EB : Sp = 9 : 1$	214.0	192.0	188.4	155.4	149.9	64.1
$EB : Sp = 7 : 3$	192.9	199.3	185.3	191.8	183.6	6.0
$EB : Sp = 5 : 5$	194.0	195.9	196.7	201.4	198.9	4.9
Sputtering	292.5	302.5	305.1	279.3	293.0	0.5

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Applied Optics