Abstract

This Letter presents a method for the fabrication and integration of a thin ${\mathrm{LiNbO}}_3$ substrate with a Si handle wafer. An inverted ridge structure guides a single optical mode in an electro-optic modulator fabricated on a mechanically thinned substrate. To define an optical waveguide, a ridge structure is first patterned on a 500 μm thick X-cut ${\mathrm{LiNbO}}_3$ wafer; then a low dielectric constant adhesive layer is used to bond the etched ${\mathrm{LiNbO}}_3$ to Si. The ${\mathrm{LiNbO}}_3$ is mechanically thinned to 4 μm, and planar electrodes are patterned. Experimental results demonstrating modulation with a $V_{\pi }L$ of 7.1 V-cm were shown, optical loss was low enough, and film quality high enough, to enable an interaction length of 0.8 cm.

© 2016 Optical Society of America

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