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Precise and simple optical alignment method for double-sided lithography

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Abstract

A method for aligning a photolithographic mask at the top of a transparent wafer that has a pattern on its bottom side is presented. The method is based on optical self-imaging of special alignment marks and provides submicrometer accuracy. The method is simple and robust and can conveniently be implemented on laboratory mask aligners for contact or proximity printing.

© 2001 Optical Society of America

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