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Direct optical wire bonding through open-to-air polymerization for silicon photonic chips: publisher’s note

Hyun-Woo Rhee, Joonsup Shim, Jae-Yong Kim, David Juseong Bang, Hyeonho Yoon, Myeongho Kim, Chong Cook Kim, Jong-Bum You, and Hyo-Hoon Park

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Abstract

This publisher’s note contains a correction to Opt. Lett. 47, 714 (2022) [CrossRef]  .

© 2022 Optica Publishing Group

In [1], the e-mail address of Jong-Bum You was inadvertently left out of the published paper. The article was corrected online on 4 February 2022.

REFERENCES

1. H.-W. Rhee, J. Shim, J.-Y. Kim, D. J. Bang, H. Yoon, M. Kim, C. C. Kim, J.-B. You, and H.-H. Park, Opt. Lett. 47(3), 714 (2022). [CrossRef]  

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