Abstract
We investigated the physical mechanism of high-efficiency glass microwelding by double-pulse ultrafast laser irradiation by measuring the dependences of the size of the heat-affected zone and the bonding strength on the delay time between the two pulses for delay time up to 80 ns. The size of the heat-affected zone increases rapidly when the delay time is increased from 0 to 12.5 ps. It then decreases dramatically when the delay time is further increased to 30 ps. It has a small peak around 100 ps. For delay time up to 40 ns, the size of the heat-affected zone exceeds that for a delay time of 0 ps, whereas for delay time over 60 ps, it becomes smaller than that for a delay time of 0 ps. The bonding strength exhibits the same tendency. The underlying physical mechanism is discussed in terms of initial electron excitation by the first pulse and subsequent excitation by the second pulse: specifically, the first pulse induces multiphoton ionization or tunneling ionization, while the second pulse induces electron heating or avalanche ionization or the second pulse is absorbed by the localized state. Transient absorption of glass induced by the ultrafast laser pulse was analyzed by an ultrafast pump–probe technique. We found that the optimum pulse energy ratio is unity. These results provide new insights into high-efficiency ultrafast laser microwelding of glass and suggest new possibilities for further development of other ultrafast laser processing techniques.
©2012 Optical Society of America
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