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Conferences > OFC > 2024 > M3B > M3B.4

Multi-Dimensional Light Field Manipulation on Diverse Integrated Photonic Platforms

Jian Wang

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Abstract

We review advances in multi-dimensional (frequency, time, complex amplitude, polarization, spatial structure) light field manipulation on diverse integrated photonic platforms (silicon, silica, polymer, III-V, metal, fiber). Silicon photonic integrated circuits, femtosecond laser direct writing 3D photonic chips, InP active photonic integrated devices, and metasurfaces for shaping light are demonstrated. Potential applications and future perspectives are discussed.

© 2024 The Author(s)

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