Abstract
We have demonstrated photonic packaging compatible with standard, high-throughput, microelectronics assembly lines. We show a 1.3dB fiber-to-chip loss and 1.1dB chip-to-chip loss. We discuss the rationale behind this approach and compare to other packaging directions.
© 2017 Optical Society of America
PDF ArticleMore Like This
Tymon Barwicz, Yoichi Taira, Ted W. Lichoulas, Nicolas Boyer, Hidetoshi Numata, Yves Martin, Jae-Woong Nah, Shotaro Takenobu, Alexander Janta-Polczynski, Eddie L. Kimbrell, Robert Leidy, Marwan Khater, Swetha Kamlapurkar, Sebastian Engelmann, Yurii A. Vlasov, and Paul Fortier
W3H.4 Optical Fiber Communication Conference (OFC) 2015
Tae Joon Seok, Victor Kopp, Dan Neugroschl, Johannes Henriksson, Jianheng Luo, and Ming C. Wu
Th5D.7 Optical Fiber Communication Conference (OFC) 2017
Lars Brusberg, Jason R. Grenier, Şükrü Ekin Kocabaş, Aramais R. Zakharian, Lucas W. Yeary, Daniel W. Levesque, Barry J. Paddock, Robert A. Bellman, Robin M. Force, Chad C. Terwilliger, Clifford G. Sutton, Jeffrey S. Clark, and Katerina Rousseva
Tu3A.3 Optical Fiber Communication Conference (OFC) 2022