Abstract
Analysis of today's logic interface fiber-optic modules reveals that both manufacturability and cost are not constrained by the semiconductors that implement the functionality, but rather by the packaging and interconnects. We have developed an innovative assembly technology that eliminates traditional hermetic metal enclosures, separate optical subassemblies, and circuit boards. This approach benefits from commonality with the plastic packaging of integrated circuits, and has already been successfully applied to modules operating with large core fiber in benign environments. We believe this is the first example successfully extending this technology to long-wavelength telecommunication applications in uncontrolled operating environments. We have designed a SONET1 intermediate reach 155 Mbit/s logic interface optical receiver module based on this novel packaging.
© 1996 Optical Society of America
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