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Conferences > IPRSN > 2017 > IW3A > IW3A.2

A High-Volume CMOS Platform for Electronic-Photonic Integration

Mark Wade

Open Access Open Access

Abstract

We present recent progress in integrating photonics into unmodified, high-volume microelectronics processes including the first CPU chip with photonic I/O, 40 Gb/s PAM4 microring modulators, grating couplers, and microring transceivers.

© 2017 Optical Society of America

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