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Conferences > CLEO_SI > 2023 > STh3H > STh3H.6

Vertically Stacked Passive Silicon Photonic Chiplet by µ-Transfer Printing

Rai Kou, Guangwei Cong, Noritsugu Yamamoto, Hitoshi Kawashima, Yuriko Maegami, Toshiya Murai, Tai Tsuchizawa, Akihiro Noriki, Takeru Amano, and Koji Yamada

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Abstract

We device double-layer stacked silicon photonic MMIs by µ-Transfer Printing. A 900×100-µm2-size chiplet consisting of a 220/60-nm-thick silicon core/slab structure is transferred twice onto thermal- and TEOS-SiO2 under-cladding layers.

© 2023 The Author(s)

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