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Conferences > CLEOPR > 2017 > PDTOCII > s2069
  • 2017 Conference on Lasers and Electro-Optics Pacific Rim
  • (Optica Publishing Group, 2017),
  • paper s2069

Hybrid Silicon Photonics Flip-Chip Laser Integration with Vertical Self-Alignment

A. Moscoso-Mártir, F. Merget, J. Mueller, J. Hauck, S. Romero-García, B. Shen, F. Lelarge, R. Brenot, A. Garreau, E. Mentovich, A. Sandomirsky, A. Badihi, D. E. Rasmussen, R. Setter, and J. Witzens

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Abstract

We present a flip-chip integration process in which the vertical alignment is guaranteed by a mechanical contact between pedestals defined in a recess etched into a silicon photonics chip and a laser or semiconductor optical amplifier. By selectively etching up to the active region of the III-V materials, we can make the accuracy of vertical alignment independent on the process control applied to layer thicknesses during silicon photonics or III-V chip fabrication, enabling alignment tolerances below ±10 nm in the vertical (Z-)direction.

© 2017 Optical Society of America

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