Abstract
In the development of new ICs, cutting thin aluminum or polysilicon conduction stripes is effective in identifying trouble spots due to errors in designing or processing. This procedure is called debugging. The two conventional cutting techniques are inadequate for fine patterns. Scratching stripes with a metal whisker requires great skill. Also, it is difficult to cut stripes cleanly by Gaussian laser spot irradiation.
© 1981 Optical Society of America
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