Abstract
By numerical analysis, when packing laser disk crystal, using the Copper tungsten CuW75 which contain 25% mass fraction copper as the heatsink and gold-tin eutectic solder layer of greater than 50um thickness, the residual stress of solder layer after soldering process will be below tensile strength. In such a configuration, packing disk active laser gain mirror can increase the yield ratio.
© 2014 Optical Society of America
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