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Conferences > ACPC > 2019 > S4H > S4H.1
  • Asia Communications and Photonics Conference (ACPC) 2019
  • OSA Technical Digest (Optica Publishing Group, 2019),
  • paper S4H.1

Silicon Photonic devices and circuits based on hybrid integration

Liu Liu, Pengxin Chen, Ziliang Ruan, and Xian Zhang

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Abstract

Hybrid integration technology, including die-to-wafer bonding and flip-chip bonding, is introduced for realizing high-performance modulators and lasers on a silicon photonic integrated circuit.

© 2019 The Author(s)

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